COOLING APPARATUS HAVING ELECTROSTATIC CHUCK OF WHICH THE COOLING GAS PROFILE IS IMPROVED

摘要

PURPOSE: A cooling apparatus having an electrostatic chuck of which the cooling gas profile is improved is provided to uniformly maintain the temperature of a wafer during a process, by making the diameter of the electrostatic chuck have substantially the same size as the wafer and by disposing a part of cooling gas holes on a circumference adjacent to the edge of the electrostatic chuck and the rest of the cooling gas holes in a portion adjacent to the center of the electrostatic chuck. CONSTITUTION: The wafer(20) is loaded to the cooling apparatus which has the electrostatic chuck(10) having substantially the same diameter as the wafer. A plurality of fixing apparatuses include a contact surface in contact with the side surface of the wafer to align the center of the wafer and the center of the electrostatic chuck such that the contact surface is inclined. The fixing apparatuses are disposed on the side surface of the wafer at regular intervals.