| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of a stacked chip semiconductor device that wire bonding between each semiconductor chip and a lead is not stable. SOLUTION: In a stacked chip semiconductor device, thickness of sealing resin from the element face of a semiconductor chip can be regulated constantly by the total thickness of a die pad 2 and a thermosetting adhesive sheet 7 because the die pad 2 is exposed, on the side opposite to the sticking face of the thermosetting adhesive sheet 7, in flush with the surface of a sealing resin 6 under resin molded state. First and second semiconductor chips 3f, 3s are rectangular and stacked while forming a constant amount of overhang such that the long side of the second semiconductor chip 3s is orthogonal to the short side of the first semiconductor chip 3f. Consequently, each semiconductor chip is connected stably with an inner lead part 1a through thin metal wires 5f, 5s. |
