发明名称 RAPID MOLD WALL HEATING SYSTEM USING VAPOR DEPOSITION
摘要 PURPOSE: A heating system for rapid heating of a mold wall using vapor deposition is provided to improve the quality of a molded product by setting up the temperature of a mold over the glass transition temperature during an injection process and a dwelling-compressing process. CONSTITUTION: A heating system is for accomplishing rapid temperature response by coating a heat supply source to the wall face of an injection mold. The heat supply source is heated by the electrical resistant heat of a power supply unit. As the heat supply source, a heating source deposited by vapor deposition for a desired temperature gradient. Vapor deposition method offers excellent hardness and even surface of the deposited face. By minimizing the thickness of the heat supply source coat, heating and cooling is realized in a short time. An insulating material is coated on the surface of the cavity of the mold to insulate the heat supply source from the mold. By controlling the temperature of the mold, fluidity of resin and the quality of an injected product are improved. As the product is released after being sufficiently cooled, bending deformation is restrained. Moreover, prompt temperature change economizes a molding process.
申请公布号 KR20010091735(A) 申请公布日期 2001.10.23
申请号 KR20000013723 申请日期 2000.03.17
申请人 KANG, SHIN ILL;LEE, HEE BONG;MOON, SU DONG 发明人 KANG, SHIN ILL;LEE, HEE BONG;MOON, SU DONG
分类号 B29C45/76;(IPC1-7):B29C45/76 主分类号 B29C45/76
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