发明名称 Test device for flat electronic assemblies
摘要 A test device for testing an electronic board assembly with an exposed surface area with electrical connection locations to be contacted for testing includes a probe (32, 45) and a drive system for positioning the probe in orthogonal X and Y directions parallel with the surface area. The drive system includes a probe drive (11) for positioning the probe to contact a selected sub-area of the surface area, the probe drive being movable in all movement coordinates independently of any other probe drives in said test device. The sub-area is selected to include component locations (34) on the board assembly. Several probe drives (11) and several probes can be used at one time, each drive having a probe (13). The probe drives are supported so that the probes (13) can be moved to contact sub-areas adjacent to each other. The probe is an elongated needle with a contact tip and is mounted for pivotal movement. A probe drive can include two transverse drives (15, 17) disposed at different distances from the surface area and movable in different directions (X, Y), at least one of the transverse drives including a gimbal mount for holding the needle (13) for universal movement, the needle being longitudinally movable in the gimbal mount. A vertical drive longitudinally moves the needle and probe toward and away from the surface area.
申请公布号 US6307389(B1) 申请公布日期 2001.10.23
申请号 US19970875666 申请日期 1997.12.22
申请人 SCORPION TECHNOLOGIES AG 发明人 BUKS MANFRED;SCHALLER PETER;KRUEGER JENS
分类号 G01R1/06;G01R1/067;G01R1/073;G01R31/02;G01R31/28;H01L21/66;H05K3/34;(IPC1-7):G01R1/02 主分类号 G01R1/06
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