发明名称 THIN FILM FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To reduce particles in a reaction furnace and in a passage for feeding gaseous starting materials in a thin film deposition method by which gaseous starting materials in which aluminum chloride, titanium chloride and water are vaporized are alternately fed to a reaction furnace 10 to form an alternately laminated thin film of aluminum oxide and titanium oxide on a substrate. SOLUTION: A plurality of gaseous starting material feeding systems 30, 40 and 50 to feed gases into a reaction furnace 10 are provided in accordance with each gaseous starting material. In each gaseous starting material feeding system, by switching valves A4, T4 and H4 and valves A5, T5 and H5, gaseous nitrogen as inert gas can be fed as pulses to the inside of a passage 31 for feeding gaseous starting materials and the reaction chamber so as to generate the variation of pressure. Before a thin film deposition stage, this pulsating feed of gaseous nitrogen is successively performed so that timing is deviated per each gaseous starting material feeding system.
申请公布号 JP2001234345(A) 申请公布日期 2001.08.31
申请号 JP20000054424 申请日期 2000.02.25
申请人 DENSO CORP 发明人 SUGIURA KAZUHIKO;MIZUTANI KOJI;KATAYAMA MASAYUKI;MIYAJI SAKAE
分类号 C30B25/02;C23C16/44;H01L21/205;H01L21/31;(IPC1-7):C23C16/44 主分类号 C30B25/02
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