发明名称 Method for forming a thin-film resistor
摘要 A method for forming a thin-film resistor includes forming two insulators on the thin-film resistor, forming contact holes by performing wet etching processes, and forming interconnect and contact plugs at the same time. The invention also provides another method for forming a thin-film resistor that forms a thin-film resistor over the passivation layer instead. That is, forming a thin-film resistor on the top of the device, so that the resistance can be re-modified according to the actual needs.
申请公布号 US6272736(B1) 申请公布日期 2001.08.14
申请号 US19980191827 申请日期 1998.11.13
申请人 UNITED MICROELECTRONICS CORP. 发明人 LEE JIA-SHENG
分类号 H01C1/032;H01C7/00;H01C17/12;H01L21/02;H01L23/522;H01L27/08;(IPC1-7):H01C17/06 主分类号 H01C1/032
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