| 摘要 |
PURPOSE: A spray apparatus for treating a glass substrate or a wafer is provided to prevent drying defects such as water spot by using IPA vapor and solvent vapor in drying a substrate and spraying a small amount of fluid through a spray hole, thereby not forming a vortex, and save fluid by reusing fluid left over after using. CONSTITUTION: The spray apparatus comprises a spray part (120) spraying IPA vapor and solvent vapor as a fluid; and a supply part (111) for recycling fluid remaining after spraying or supplying new fluid in a spray apparatus in which a glass substrate (100) or a wafer is treated by spraying fluids, wherein the glass substrate or wafer is dried in fluid in the floating state by kinetic energy generated when pressure spraying the IPA vapor or solvent vapor through a nozzle (101), and low surface tension they have. |
