发明名称 DRIVE SUBSTRATE DEVICE
摘要 PROBLEM TO BE SOLVED: To cope with the use of any sockets by a single printed wiring board by at least partially overlapping socket mounting parts for a thick neck and for a thin neck with the center part of the printed wiring board in a rectangular shape. SOLUTION: For the printed wiring board 17 in the rectangular shape for which a prescribed circuit pattern is arranged on a back surface, a through-hole 18 for inserting the exhaust part of a cathode-ray tube is provided on the almost center part and a tongue piece 19 integrated with the printed wiring board 17 is arranged at the through-hole 18 so as to close the part of the through-hole 18. At the part of the outer peripheral printed wiring board 17 of the through- hole 18, pin holes 20 for inserting plural socket pins for the thin neck are annularly pierced and the socket mounting part 9 for the thin neck is formed. Further, at the outer periphery of the pin holes 20, the pin holes 21 for inserting the socket pins for the thick neck are annularly pierced similarly and the socket mounting part 8 for the thick neck is formed. The respective pin holes 20 and 21 are pierced so as to be positioned at a prescribed circuit pattern part on the back surface.
申请公布号 JP2000354212(A) 申请公布日期 2000.12.19
申请号 JP19990165157 申请日期 1999.06.11
申请人 TOSHIBA CORP 发明人 KANEKO MORIO
分类号 H01J29/92;H04N5/64;(IPC1-7):H04N5/64 主分类号 H01J29/92
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