| 摘要 |
PROBLEM TO BE SOLVED: To reduce a load onto a wiring pattern from insulating particles when a pressure is applied in order to mount a semiconductor. SOLUTION: A mounting member 12 located between the electrode of a semiconductor and the electrode of a wiring board in order to secure the semiconductor onto the printed wiring board by applying heat and/or pressure has two layers, i.e., an insulating adhesive layer 10 principally comprising a binder 3 containing no large particle component except some additives for adjusting physical properties, and an anisotropic conductive adhesive layer 11 containing conductive particles 5. Since the insulating adhesive layer 10 containing no large particle component comes into direct contact with the semiconductor when it is mounted on the printed wiring board, insulating particles 4 do not touch the surface of the semiconductor when a pressure is applied in order to mount the semiconductor. |
