发明名称 ETCHING TREATING AGENT FOR COPPER AND COPPER ALLOY
摘要 PROBLEM TO BE SOLVED: To prevent the corrosion of a circuit even in the case water-washing after treatment is insufficient and to avoid trouble such as disconnection or the like by composing this agent of an aq. soln. contg. the ferric complex of a complexane compd., halogen ions and/or an imidazole compd. as essential components and controlling the pH of the soln. to a specified range. SOLUTION: A complexane compd. works as an oxidizer for copper and a copper alloy by forming a complex with ferric ions in an aq. soln. of pH 5 to 8, dissolves metallic copper oxidized by the ferric complex and stably makes it soluble as the copper complex of the complexane compd. As the complexane compd., iminodiacetic acid or the like can be given. An imidazole compd. has the action of increasing the oxidizing force of the ferric complex of the complexane compd. for copper and a copper alloy and moreover dissolving the oxidized metallic copper, and imidazole or the like can be given. Halogen ions act similarly to the imidazole compd., and, as the ion source, sodium chloride or the like is used.
申请公布号 JP2000328268(A) 申请公布日期 2000.11.28
申请号 JP19990132518 申请日期 1999.05.13
申请人 SHIKOKU CHEM CORP 发明人 KIKUKAWA YOSHIMASA;HIRAO HIROHIKO;TANIOKA MIYA
分类号 H05K3/06;C23F1/18;(IPC1-7):C23F1/18 主分类号 H05K3/06
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