| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer printed wiring board which can surely realize interlayer connection of wiring layers, when a multilayer printed wiring board of IVH structure is formed, and is superior in alignment accuracy. SOLUTION: A film 3 is stuck on a resin substrate 1 of a resin substrate 11 with a copper foil, and an aperture part is formed in the film 3 and the resin substrate 1 by laser working, using the copper foil 2 as a stopper. The sidewall surface of an aperture part 4 and the copper foil surface are subjected to cleaning treatment, the aperture part 4 is filled with a conductive paste, the film 3 is peeled and removed, and an outer layer substrate 10 is formed in which a semicured conductive paste conductor 5, having protruding parts on the resin substrate 11 with a copper foil, is formed. An outer layer substrate 20 is formed by a similar process. An inner layer substrate 30, in which a wiring layer 22 and a wiring layer 23 are formed, is made a core. The outer layer substrate 10 and the outer layer substrate 20 are laminated on both sides of the core. A multilayer printed wiring board is formed by heating and pressing with pressure. |
