DIE BONDING APPARATUS AND METHOD

摘要

PURPOSE: An apparatus and a method for die bonding are provided to improve yield and further to prevent a distortion of a circuit film by bonding a bad die to a bad unit in the circuit film. CONSTITUTION: A printed circuit film(12) having good units and bad units is supplied to a guide rail(40) from a magazine(10), whereas a wafer(32) having good dies or chips(38) is supplied to a wafer table(34) from a cassette(30). In addition, a tray(56) for carrying bad dies or chips(52) is supplied to a bad chip table(54) adjoining the wafer table(34). An inspective element such as a camera(56) being provided above the guide rail(40), the circuit film(12) moved along the guide rail(40) is stopped underneath the camera(56) and then tested to classify units into good or bad. According to the test result, the good die(38) or bad die(52) is loaded onto a stage(44) by a pickup collect(46) through a transfer arm(48), and then the stage(44) is moved under the guide rail(40). When the dies(38,52) on the stage(44) is provided under the circuit film(12) in the guide rail(40), a mount head(42) presses down the circuit film(12) and thereby the die(38,52) is bonded to the circuit film(12).