| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition excellent in soldering resistance, heat dissipation properties, and fluidity by mixing a biphenyl type epoxy resin with a phenolic resin and an attrited crystalline silica powder in a specified ratio. SOLUTION: This composition comprises a biphenyl type epoxy resin represented by formula I, a phenolic resin, desirably being a phenolic resin represented by formula II or III, and an inorganic filler containing at least 50 wt.%, based on the entire inorganic filler, attrited crystalline silica powder. In the formulae, R1 to R4 are each H or a 1-4C alkyl; (n)is O or a positive integer; R5 and R6 are each H or a 1-5C alkyl; m=n. The inorganic filler optionally contains a fused silica powder and/or an alumina powder in addition to the attrited crystalline silica powder. The mixing ratio of the biphenyl epoxy resin of formula I to the phenolic resin is desirably such that 0.8-1.2 equivalents of the OH groups of the phenolic resin are present per equivalent of the epoxy groups of the epoxy resin component.
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