| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame clamping device, which reduces the rate of occurrence of defectives in a bonding. SOLUTION: A clamper 5 is constituted of a clamper main body 5a coming into contact with a clamper pressure pin 6c of a pin fixing arm 6 and a plurality of pressing parts 5b integrally formed in such a way that the pressing parts 5b press down bonding pads 3a, which are provided on a lead frame 3 and are formed in one-sided four rows, on the lead frame 3. Each pressing part 5b of the clamper 5 is always contacted with the lead frame 3 and always presses down the lead frame 3 on a heat rail 4 by the own weight of the clamper 5. Thus, warping, which are generated in the lead frame 3, are suppressed by the rail 4 and the lead frame 3 is always adhered closely to the rail 4.
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