| 摘要 |
PROBLEM TO BE SOLVED: To provide a testing method for CSP(chip-scale package), capable of avoiding the dislocation of solder to contact pins also facilitating the handling of the CSP. SOLUTION: In this testing method, Au-plated lands 7a are provided in a ball fitting hole 7 on a frame substrate 1 in the loading state of IC chips 2 so that the testing can be performed by bringing contact pins 6a into contact with these lands 7a later for fitting balls 3 to be cut into a final shape.
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