METHOD FOR MANUFACTURING AN INDIUM BUMP USING A PLASMA

摘要

PURPOSE: An H2 plasma reflow method is provided to improve a bonding reliability and a fatigue life by using an indium bump used as an interconnection of IRFPA(infrared focal plane array) having high height. CONSTITUTION: The method comprises the steps of depositing a protective layer on a chip; opening a portion of a conductive metal pad using a photoresist pattern as a mask; depositing an UBM(under bump metallurgy) on the resultant structure; removing the photoresist pattern to form a diffusion prevention pattern; forming an indium bump having a wide cross sectional area compared to the UBM; and reflowing the indium bump by exposing the indium bump to a plasma.