A water-based solder resist composition characterized by comprising: (a) a water-soluble or water-dispersible photopolymerizable resin containing polymerizable unsaturated groups and carboxyl groups which have been neutralized with an amine compound; (b) a photopolymerization initiator; (c) an amino resin; and (d) a lowly reactive epoxy compound containing no epoxy group represented by general formula (1) wherein Y represents an oxygen or nitrogen atom.
