发明名称 Device and method for repairing a semiconductor memory
摘要 A redundancy architecture for repairing a DRAM includes fuse banks for storing the row addresses of defective rows in sub-arrays of the DRAM. Row decoders activate a redundant row in one of the sub-arrays in response to receiving a row address matching one of the stored defective row addresses and, at the same time, disable a redundant row in the other of the sub-arrays that is arranged in an order complementary to that of the activated redundant row. By activating a redundant row in one sub-array and disabling the corresponding redundant row in an adjacent sub-array, the architecture allows for repairs to be conducted in the one sub-array while a good row in the adjacent sub-array is allowed to continue in operation. Also, since the redundant row used for repairs in the one sub-array is typically nearest the center of the sub-array, the disabled redundant row in the adjacent sub-array is nearest the edge of that sub-array, because it is arranged in an order complementary to that of the redundant row used for repairs. As a result, the disabled redundant row acts as an edge buffer between the primary and redundant rows of the adjacent sub-array and peripheral circuitry.
申请公布号 US6005813(A) 申请公布日期 1999.12.21
申请号 US19970968439 申请日期 1997.11.12
申请人 MICRON TECHNOLOGY, INC. 发明人 WALLER, WILLIAM K.;VO, HUY T.
分类号 G11C29/00;(IPC1-7):G11C7/00 主分类号 G11C29/00
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