| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor wafer packaging container of a structure, wherein the contamination of a semiconductor wafer due to the constituent material of the container can be further reduced without needing special working processes. SOLUTION: The resin material for a semiconductor wafer packaging container molded from a polypropylene resin is formed by a method in which 0.005 to 0.050 pts.wt. of stearate metallic salt and 0.1010 to 0.050 pts.wt. of a phenol oxidation inhibitor are added to 100 pts.wt. of the polypropylene resin. Moreover, 0.020 to 0.050 pts.wt. of a secondary oxidation inhibitor, such as a sulfur or phosphorus secondary oxidation inhibitor which has hithertofore not been added or added only very slightly, is added to the polypropylene resin in the same degree as the amount of the above phenol oxidation inhibitor. Moreover, the molding conditions of the packaging container are 170 to 250 deg.C in molding temperature, within 40 minutes in heating time in a molding machine and 30 to 80 deg.C in the temperature of a metal mold, and a thermal history exerted on the resin material at the time of molding of the packaging container is inhibited low.</p> |
