| 摘要 |
A wafer is gripped by a chuck part provided at a front end of a slide arm, and the slide arm is moved in the first direction from a reference position, from which the workpiece is transferred to a workpiece cutting part, to a cleansing position, where the cut workpiece is cleansed, so that the wafer can be transferred in the first direction. The wafer is gripped by a chuck part provided at a front end of a rotary arm, which is rotatably supported at a base end by the front end of the slide arm. Then, the slide arm is moved in the first direction and the rotary arm is rotated. Thereby, the wafer can be transferred in the second direction, which is perpendicular to the first direction.
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