| 摘要 |
PROBLEM TO BE SOLVED: To improve productivity by cutting a block into a plurality of units in thickness direction by a method, wherein an assembled body, formed by connecting a common substrate plate and a chip, is put in a mold, a hexahedron block is formed by injecting a container material into the mold, and the block is cut into a plurality of units in the thickness direction. SOLUTION: A plurality of groups 104 are arranged on a surface 102a in matrix form, a number of chips 103 are attached to the region 109 on a surface 102b, and they are arranged in matrix form corresponding to the groups 104 of an electrical connection region 104a on the entire region of a plate 102. After the connection pad 110 of the chips 103 and an electrical connection wire 105 have been connected, they are put in an injection molding mold 112, resin is injected into a cavity 116, a block 117, consisting of four containers 106, is formed by a molding operation, and it is cut by a saw. As a result, semiconductor packages 1 of different sizes can be manufactured in the same type by housing them in a prescribed common substrate plate 102. |
