发明名称 HEAT RADIATING BODY
摘要 PROBLEM TO BE SOLVED: To obtain a heat radiating body utilizable as a general-purpose heat radiating member by forming a composite plating layer consisting of diamond particles and a metal on a substrate of a metal, ceramic or plastic and using the substrate or the composite plating fayer peeled from the substrate as a heat radiating or heat conductive member. SOLUTION: Diamond particles of about <=38μm particle diameter are suspended in a high heat conductivity metal plating bath such as a copper plating bath and a composite plating layer consisting of diamond particles and the metal is formed on a substrate of a metal, ceramic or plastic while uniformly distributing the particles by stirring or circulating the soln. At this time, electroplating or electroless plating is selected in accordance with conditions such as the shape and dimensions of the substrate and the selection does not depend on the material of the substrate. The substrate with the formed composite plating layer or the plating layer peeled from the substrate is used as a heat radiating or heat conductive member and the objective heat radiating body having high heat conductivity, satisfactory heat radiating property, a high rate of heat exchange, high freeness of mounting and high adaptability is obtd.
申请公布号 JPH10310893(A) 申请公布日期 1998.11.24
申请号 JP19970135816 申请日期 1997.05.09
申请人 OUDENSHIYA:KK 发明人 WATANABE EIJI
分类号 C25D1/00;(IPC1-7):C25D1/00 主分类号 C25D1/00
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