发明名称 |
Moulding composition based on polypropylene |
摘要 |
<p>Moulding materials (I) comprise (A) polymers of propylene and≤20 wt.% other monomers, contg. (B) 0.05-0.4 wt.% mono- or poly-basic carboxylic acid amide(s) with a mol. wt. of 150-600 and (C) 0.1-3.0 wt.% ethylene polymer with≤20 wt.% comonomers, with a density of 0.890-0.945 g/cm<3> and a MFI 190/2.16 of 10-100 g/10 mins.. Also claimed are films and mouldings made from (I), such as injection syringes. Pref. (A) is a polypropylene homopolymer or a copolymer of 90-99.9 wt.% propylene and 0.1-10 wt.% ethylene and/or 4-10C alk-1-ene. (B) is 13-docosenoic acid amide (erucamide) and/or 9-octadecenoic acid amide (oleamide), in amts. of 0.08-0.2 wt.%.</p> |
申请公布号 |
EP0677554(B1) |
申请公布日期 |
1998.07.15 |
申请号 |
EP19950105264 |
申请日期 |
1995.04.07 |
申请人 |
BASF AKTIENGESELLSCHAFT |
发明人 |
SEILER, ERHARD, DR.;SCHOENE, WERNER, DR. |
分类号 |
C08J5/16;C08J5/18;C08L23/06;C08L23/08;C08L23/10;C08L23/12;C08L23/14;(IPC1-7):C08L23/10 |
主分类号 |
C08J5/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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