| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent a defective contact point by a mechanical deformation and sharply improve durability and reliability by containing metal powder including a low-melting point alloy, mainly made of Sn and one or more kinds of metals selected from Bi, In, Ag. SOLUTION: This conductive paste is mainly constituted of metal powder (A), made of at least one kind of metal selected from Ag, Au, Pd, Pt or two or more kinds of alloys of these metals, metal power (B) made of an alloy containing Sn and at least one kind of metal selected from Bi, In, Ag, a binder (C) such as a copolymer polyester resin or a polyester urethane resin, and an ester or ketone solvent (D). The weight ratio between the metal powder (A)/ metal powder (B) is set to the range of 10/1-1.5/1, and the average grain size ratio between the metal powder (A)/metal powder (B) is set to 100/1-1/1.</p> |
