| 摘要 |
PROBLEM TO BE SOLVED: To simplify the processing step causing no cracking at all on the outer periphery of an FPC in the perforating step. SOLUTION: In FPC circuit substrate with a reinforcement board, a reinforcement board 2 in thickness of 125-200μm making end shape so as to make an angle of its endline with respect to the contour line of the circuit exceeding 15 deg. but not exceeding 30 deg. is used. Next, the reinforcement board 2 with the specific end shape is laminated on the circuit substrate to be manufactured. In such a constitution, the reinforcement board made of a plurality of circuits with mutually connected shape is to be used.
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