| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to easily and hermetically seal wiring materials, lead terminals, etc., by supporting the optical element mounting side of a first substrate on a second substrate and tightly covering the surface of this second substrate with a covering material including its optical transmission lines and optical elements. SOLUTION: The optical element 35, 36 side of the first substrate is entirely integrated and covered including the bonding wires by the second substrate 41 and covering material 61 adjusted to have the equal coefft. of linear expansion. The influence that external light intrudes to the parts of the optical elements 35, 36 is, therefore, eliminated and the entire part expands and shrinks cooperatively with respect to a temp. change, thereby obviating the occurrence of such inconvenience that the peeling occurs at the boundary with, for example, the first substrate 31 based on the internal stress fluctuation and expansion and contraction. If the element is a light emitting element (LD chip) 35, the heat generated according to the operation is transmitted to the element placing plate 47. The heat is transmitted to a suitable external heat transmission means or heat radiating means through the lead terminals connected to the placing plate 47, by which the temp. rise of the element may be suppressed. |
