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发明名称
EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING
摘要
申请公布号
JPH1060228(A)
申请公布日期
1998.03.03
申请号
JP19960225237
申请日期
1996.08.27
申请人
SUMITOMO BAKELITE CO LTD
发明人
OTA MASARU
分类号
C08K3/00;C08G59/40;C08G59/62;C08L63/00;H01L23/29;H01L23/31;(IPC1-7):C08L63/00
主分类号
C08K3/00
代理机构
代理人
主权项
地址
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