| 发明名称 |
SEMICONDUCTOR DEVICE AND ITS MANUFACTURE |
| 摘要 |
PROBLEM TO BE SOLVED: To protect metal wirings made of aluminum alloy containing copper from corroding. SOLUTION: A 1st insulating film 11 is formed on a semiconductor substrate 10 and metal wirings 12 made of aluminum alloy containing copper are formed on the 1st insulating film 11. Reflection preventive films 13 are formed on the upper surfaces of the metal wirings 12. On both the side surfaces of the metal wiring 12 where aluminum oxide films are not formed, copper sulfide films 14 are formed. A 2nd insulating film 15 is formed over the whole surfaces of the metal wirings 12 on which the reflection preventive films 13 and the copper sulfide films 14 are formed and the 1st insulating layer 11. |
| 申请公布号 |
JPH09298199(A) |
申请公布日期 |
1997.11.18 |
| 申请号 |
JP19960232043 |
申请日期 |
1996.09.02 |
| 申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
KAWAGUCHI AKEMI;KUBO MINORU;AOI NOBUO |
| 分类号 |
H01L23/52;H01L21/027;H01L21/31;H01L21/314;H01L21/3205;H01L21/768;H01L23/532;(IPC1-7):H01L21/320 |
主分类号 |
H01L23/52 |
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