SOCKET FOR MEASURING BALL GRID ARRAY SEMICONDUCTOR

摘要

A socket for measuring a ball grid array semiconductor with which the contact pressures of branch contact pins on solder balls are generated nearly perpendicularly to the longitudinal directions of the contact pins and the lengths of the contact pins are determined to a requisite minimum length regardless of the contact pressure. Branch contact pins (36) formed by punching an elastic metal plate into the shape of a tuning fork are fitted in housing holes (33) made in an insulating housing. The ends of a pair of elastic branched sections (362) are contact sections (361) which are brought into contact with solder balls (12) in a BGA package (10) at two points. The direction of the areas facing the housing holes (33) is oblique with respect to the direction of arrangement of the holes, so that the mounting density of the contact pins (36) is improved.