Wire bonding method and apparatus

摘要

An electrode used in a wire bonding method and apparatus for applying an electric discharge to an end of a bonding wire so as to form a ball at the end of the bonding wire. The electrode is provided with an obliquely cut surface at one end so that the end of the electrode is in a semicircular shape, and an edge area of the semicircular end surface is positioned to face upward and used as an electric discharge part. The electrode can be covered by a ceramic material except for the semicircular end surface.