| 摘要 |
A highly efficient releasable mount heat-sink for a very large scale integrated circuit comprises a single piece (1) of a high thermal conductivity material formed of two mutually parallel plates (3,4) interconnected by a plurality of fins (2) lying across said plates to form a plurality of ducts for a refrigerating gas flow, the piece being formed with a plurality of housings (5,6,7,8) for means (16,17,18,19,20,21) of securing the heat-sink on a support (15) of the integrated circuit (14) with one (3) of the plates in contact with the integrated circuit (14). <IMAGE> |
