| 摘要 |
PURPOSE: To prevent a vertical surface mounting semiconductor device from tilting by solving the mounting problems, e.g. accurate positioning of terminal lead and short circuit. CONSTITUTION: The semiconductor device comprises a device body 4 having terminal leads 1, and a plurality of post leads for holding the device body 4 vertically. Among a plurality of post leads 2, the post lead 2 formed on same side as the terminal lead 1 projects in the longitudinal direction of the device body 4 to form a protrusion 3 having one side aligned with the extension of the tips of terminal leads 1. The protrusion 3 has the tip projecting outward from the side face of the device body 4. At the time of mounting, the device body 4 is sucked by a chuck and the position of the terminal lead 1 is corrected while recognizing the protrusion 3 from above by means of a camera 3 and then the device body 4 is lowered to a predetermined position on a board. |
