| 摘要 |
PURPOSE: To prevent a TAB lead from coming into contact with any other parts than the electrode of input and output terminals by the pressure of flow-in resin during resin encapsulation by a method wherein a lead frame is integrally provided with a support ring of a specific conductivity. CONSTITUTION: The resin encapsulation semiconductor device is provided with an island 3 for mounting a semiconductor chip 2, a lead frame having wiring connecting group 4, a TAB lead group 5 and a non-conductive suspender tape 6 for fixing the TAB lead group 5 to one side. Furthermore, conductive support ring 7 supporting the TAB lead 5 and the suspender tape 6 are integrally arranged on the other surface side of the suspender tape 6 in a specific shape not getting over the periphery of the TAB lead fixed part. In such a constitution, the suspender tape 6 and the supporting ring 7 are two-layer structured to be fixed by a bonding means 8. |
