| 摘要 |
PURPOSE:To obtain an electronic device, and fabrication method thereof, in which the degree of freedom is increased in the layout design of lands, while increasing the total number thereof, by decreasing the area required for forming the land on which a bump is formed. CONSTITUTION:The electronic device comprises a second electrode 3 formed on one side of a substrate 1 for mounting a chip and connected with the first electrode of the chip, a through hole 4 made at a position separated from the second electrode 3 in order to conduct between one and the other sides of the substrate 1, a lead 5 for connecting the second electrode 3 and the through hole 4, and a land 7 formed in an area including the through hole 4 on the other side of the substrate 1 in order to form a bump on the surface thereof. |
