| 摘要 |
PURPOSE:To improve the noise shielding property of a leadless type IC package having a small size and thin thickness. CONSTITUTION:After mounting an IC chip 12 or another chip 19 in a recessed section 101 on a wiring board 11 and sealing the chip 12 or 19 with a sealing resin 13, a conductive shielding pattern 14 which simultaneously covers the sealed area 13 and a GND pattern 16 provided on the substrate 11 near the area 13 is formed by printing. |
