发明名称 METHOD AND DEVICE FOR BONDING CURVED-SURFACE BODY TO SUBSTRATE
摘要 PURPOSE: To provide a method and device for easily allowing a curved body part to be exactly arranged and abut on a substrate. CONSTITUTION: An part holder 17 which can rise and fall is arranged in the surroundings of an abutting part 16, and a vacuum channel 18 communicated with the part holder 17 is arranged. The part holder 17 is brought into contact with a curbed body part 12, the vacuum channel 18 is made vacuum, and the curved body part 12 is sucked by the part holder 17. After the curved body part 12 is moved on an inclined supporting wall 15 of a substrate 14, the vacuum state is related, and the curbed body part 12 is dropped to a recessed part 13 in the inclined supporting wall 15. The part holder 17 is allowed to rise, the abutting face of the abutting part 16 is exposed, the abutting part 16 is allowed to fall and brought into contact with the curbed body part 12, and the curved body part 12 is pressurized on the inclined supporting wall 15.
申请公布号 JPH07181357(A) 申请公布日期 1995.07.21
申请号 JP19920248966 申请日期 1992.08.26
申请人 AMERICAN TELEPH & TELEGR CO <ATT> 发明人 FUNGU ENU NIYUUEN
分类号 B23K20/02;B23K33/00;B23P19/00;G02B6/32;G02B6/36;G02B6/42;G02B7/00;G02B7/02;(IPC1-7):G02B7/00 主分类号 B23K20/02
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