| 摘要 |
<p>PURPOSE:To improve the electrostatic breakdown voltage of an IC by providing a capacitance between a lead frame and a power supply and using the lead frame for a semiconductor device. CONSTITUTION:A thin film 2 of an insulator is provided on a main body 1 of a lead frame made of 42 alloy or the like, and a conductor 3 is provided thereon. The thin film of the insulator is made the conductor on an arbitrary lead. Thus, the lead and the conductor on the insulator are connected. Therefore, the improvement of the electrostatic breakdown voltage of an IC becomes simple. The both sides of the lead frame 1 are held with the conductors, and the potentials of the conductors are obtained from the different power supplies. At this time, the capacitance is provided between the power supplies. Therefore, the noises of the power supplies can be decreased.</p> |
