CONTAINER FOR AN INTEGRATED CIRCUIT WAFER AND METHOD FOR PREPARING THE SAME

摘要

A novel method and a container are provided for storing an integrated circuit wafer. The method comprises engaging a tray-shaped member and a complementary sheet member to form a closed container by providing a trayshaped member having a recess for holding the wafer and providing a complementary sheet member proportionately sized to, attach to, and cover the recess. At least one of the tray-shaped member and the complementary sheet member is made either from a single layer of at least one highnitrile resin, or a laminated layer of at least one thermoplastic resin and at least one gas barrier resin. The surface of the container that may contact the integrated circuit wafer has a specified resin hardness. The integrated circuit wafer is then placed in the container, an inert gas is added to the container and the integrated circuit wafer is stored in the container in the presence of that inert gas which has been added to the container. The novel container comprises a tray-shaped member having a recess for holding the wafer; and a complementary sheet member proportionately sized to, attached to and cover the recess. At least one of the tray-shaped member and the complementary sheet member is . made from either a single layer of at least one highnitrile resin or a laminated layer of at least one thermoplastic resin and at least one gas barrier resin. The surface of the container that may contact the integrated circuit wafer has a specified resin hardness. The high-nitrile resin has a specified oxygen permeability.