发明名称 |
METHOD FOR BORING SMALL HOLES IN SUBSTRATE MATERIAL |
摘要 |
A method for boring small holes in a substrate by disposing electrodes on both sides of a substrate to be machined and applying a voltage between the electrodes so as to perform plasma discharge treatment at a pressure of 10 to 2 x 10<3> Torrs. In another method, the gap of the two electrodes is set to 0.01 to 50 mm and a peak voltage to 10 V to 50,000 V in accordance with the electrode gap within the range of the voltage waveform of 5 mu s to 20 seconds. The methods make it possible to quickly and reliably accomplish removal of chips causing clogging, smoothing of the inner walls of the holes and removal of fins in the holes. |
申请公布号 |
EP0565341(A3) |
申请公布日期 |
1994.05.25 |
申请号 |
EP19930302690 |
申请日期 |
1993.04.06 |
申请人 |
SAKAE ELECTRONICS INDUSTRIAL CO., LTD.;OHBA, KAZUO;SHIMA, KAORI;OHBA, AKIRA |
发明人 |
OHBA, KAZUO;SHIMA, KAORI;OHBA, AKIRA |
分类号 |
B23B41/00;B23B47/34;B23K10/00;B26F1/28;C23F4/00;H05H1/26;H05K3/00 |
主分类号 |
B23B41/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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