| 摘要 |
<p>PURPOSE:To enable a semiconductor chip to be lessened in manufacturing cost and enhanced in yield when non-defective semiconductor chips are manufactured from a wafer. CONSTITUTION:A wafer sheet B is pasted on the rear of a wafer A, the wafer A is cut into separate semiconductor chips, then the wafer sheet B is biaxially oriented, wax 2a and 2b are applied onto the semiconductor chips 1a defective in shape and the defective semiconductor chips out of the semiconductor chips 1, and the semiconductor chips 1 are dipped into chemical liquid to separate the wafer sheet B and then screened.</p> |
