发明名称 NEGATIVE PHOTOSENSITIVE ELECTRODEPOSITION COATING RESIN COMPOSITION, ELECTRODEPOSITION COATING BATH USING THE SAME AND PRODUCTION OF RESIST PATTERN
摘要 PURPOSE:To obtain an electrodeposition coating bath having good electrodeposition property by using a negative electrodeposition coating resin compsn. containing a specified component, and to obtain a resist pattern of high resolution without incomplete development by using this bath. CONSTITUTION:This electrodeposition coating resin compsn. consists of polymers, non-water soluble monomers having two or more photopolymerizable unsatd. bonds in the molecule, non-water soluble photopolymn. initiator, and compd. expressed by formula and/or salt of this compd. with a basic compd. These polymers are prepared by neutralizing polymers having 20-300 acid value obtd. by copolymn. of acrylic acids and/or methacrylic acids with a basic org. compd. In the formula, Y is a carboxyl group or sulfonic acid group, R1, R2 and R3 are hydrogen atoms, halogen atoms, hydroxyl groups, alkyl groups, phenyl groups, etc., and n is an integer of 1-3. An electrodeposition coating film is formed on a conductive base body in an electrodeposition coating bath which uses this resin compsn. The coating film is then exposed and developed to obtain a resist pattern.
申请公布号 JPH05281721(A) 申请公布日期 1993.10.29
申请号 JP19920077216 申请日期 1992.03.31
申请人 发明人
分类号 C08F2/44;C08F2/48;C08F2/50;C09D4/00;C09D5/44;C09D133/02;C09D133/04;C25D13/00;C25D13/06;G03F7/004;G03F7/027;G03F7/028;G03F7/038;G03F7/30;H01L21/027;H05K3/00;(IPC1-7):G03F7/027 主分类号 C08F2/44
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