发明名称 ATTACHMENT OF PHOTOELECTRIC ELEMENT
摘要 <p>PURPOSE:To improve the working efficiency of attaching a photoelectric element on a substrate and to eliminate the inflow of resin of the same material as the substrate into the top surface of the photoelectric element by forming a projection made of resin on the back surface of the substrate. CONSTITUTION:The top surface 15b of a photoelectric element 15 is inserted from the back surface of the substrate through a penetrating hole, and the back surface of the substrate is brought into contact with the collar 15a of the photoelectric element 15. Thereafter, the projection 13 formed on the back surface of the substrate 11 is fused by an electric welding or ultrasonic welding or the like to cover the bottom surface of the photoelectric element 15 with the resin of the projection 13 thus fused, and to attach the photoelectric element 15 on the substrate.</p>
申请公布号 JPS5627980(A) 申请公布日期 1981.03.18
申请号 JP19790104803 申请日期 1979.08.16
申请人 OMRON TATEISI ELECTRONICS CO 发明人 WATANABE YASUYUKI;HIGUCHI ICHIROU;OGATA KAZUYUKI
分类号 H01L23/32;H01L25/13;H01L31/02;H01L31/12 主分类号 H01L23/32
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