| 摘要 |
PURPOSE:To narrow pitch as compared with prior art and to facilitate wire bonding. CONSTITUTION:A first layer lead frame 10 is superposed to be adhered to a second layer lead frame 12 in which inner leads protrude longer than those of the frame 10 through an insulation sheet 14 by deviating the first frame 1/2 pitch from the second frame. Both the inner leads have equal heights of bonding regions. In a semiconductor device chip 20, bonding pads 22 which are connected to the long inner leads are arranged outside, and short wires 26a are set lower than longer wires 26b to prevent a short-circuit in a space. |
