| 摘要 |
Printed circuit boards in which the components are secured by a sprung mounting plate are known. The mounting plate serves not only as current path but as cooling plate. Such a component fixture is not suitable for high-frequency applications. The problem of the invention is to mount high-speed chips (for frequencies of over 1 GHz), which cannot be built into small microwave housings owing to the requirements to be met for such high frequencies, on a board in such a way a connection suitable for microwave applications and the necessary heat dissipation from the component can be achieved with simple means. The basic idea of the solution is to connect the metallic base surface of the chip housing (2) to the metallic layers of the multilayer printed circuit board (1) via plated-through holes. For this purpose, the printed circuit board (1) is provided with through holes (21) which open into a mounting pad (20) on the printed circuit board (1) and which are in contact with planar conductor tracks (13, 14) in the printed circuit board. The housing base (4) is placed on the mounting pad (20) and the holes (21) are filled with a molten solder. This connects the housing (2) in a thermally and electrically conducting manner to the planar conductor tracks (13, 14). <IMAGE> |
