发明名称 WIRING BOARD USING COAXIAL WIRE AND MANUFACTURE THEREOF
摘要 PURPOSE:To eliminate a crosstalk noise and to make possible a high-speed signal processing by a method wherein the core wires, which are used as signal conductors, of coaxial wires and the shielding layers of the coaxial wires are efficiently isolated from each other. CONSTITUTION:An adherent insulating layer 3 is formed on the surface of a circuit board 2 having a ground layer 1 and plurality of coaxial wires 4 are provided in a desired form. As the wires 4, wires 4 provided with adhesion layers for wire use, which have a superior adhesion to the layers 3 and are provided on the outermost layers of the wires 4 for an increase in the density of elements and the improvement of the workability of wiring, are used. Then, an insulating layer 11 is provided for fixing the wires 4, a laser beam is irradiated on parts, at which through holes 6 and 8 are respectively formed, to remove organic matters and shielding layers 5 of the wires 4 are exposed. As the wires 4 are used on a wiring board in such a way, no crosstalk noise is generated and a signal can be speeded up by using low-dielectric constant layers for wire insulating layers 9 of the wires 4. Moreover, a fluctuation in a dielectric impedance can be lessened by using the wires 4.
申请公布号 JPH0482295(A) 申请公布日期 1992.03.16
申请号 JP19900196904 申请日期 1990.07.25
申请人 HITACHI CHEM CO LTD 发明人 IWASAKI YORIO;OKAMURA TOSHIRO;KOJIMA FUJIO;ARIGA SHIGEHARU;SHIMADA YASUSHI
分类号 H05K3/10;H05K3/46 主分类号 H05K3/10
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