| 摘要 |
PURPOSE:To shorten a lead section which connects an I/O terminal in a package with a connection terminal of a thick film wiring board by bending the I/O terminal along the inner peripheral surface in the side wall of the package so that the tip of an outside lead terminal introduced the envelop through the side wall of the package may approach the connection terminal of the built-in hybrid main circuit body. CONSTITUTION:On a heat radiation board 4 is vertically installed a resin-made cylinder-shaped body 5 (package main body) as it surrounds a hybrid circuit main body 3. An I/O terminal 6 is laid out, which penetrates the side wall of the cylinder-shaped body 5. The tip of the I/O terminal introduced into the package main body 5 is bent downward along the inner wall surface of the package main body 5 and is brought near the hybrid circuit main body 3. Both ends of an L-shaped lead wire 7 are polymerized with each other and electrically connected with each other by means of soldering on the side of the I/O terminal 6, which is bent downward along the inner wall surface of the package main body 5 and brought near the hybrid circuit main body 3 and a connection termi nal 1a side formed on a board 1 of the hybrid circuit main body 3. |
