| 摘要 |
PURPOSE:To form a glass terminal which has excellent heat dissipation capacity by sealing a heat sink for mounting component on an eyelet by vertically penetrating the eyelet. CONSTITUTION:Semiconductor element 50, etc. is mounted on the top plane of a heat sink 40 projected at the top of an eyelet 10. The electrodes of the element, etc. are connected with the top edges of leads 20 projected at the top of the eyelet 10 through wires 60. Then, the top of the eyelet 10 which contains the top part of the heat sink 40 mounted with the semiconductor element 50, etc. is covered with a cap 70 and the bottom edge of the cap 70 is air-tightly sealed with the eyelet 10 by resistance welding, soldering, etc. The eyelet 10 is mounted on a substrate and a stand off composed of the bottom part of the heat sink 40 projected at the bottom of the eyelet 10 is abutted on the substrate, etc. The bottom parts of the leads 20 projected at the bottom of the eyelet 10 are inserted into through holes provided on the substrate so as to connect with circuits provided on the inner circumferencial planes and the leads are connected with the circuits of the substrate. |
