| 摘要 |
PURPOSE:To reduce the generation of blisters in inner layer circuits and efficiently produce a multilayer wiring board by arranging a prepreg and an unclad plate on an inner layer member side and a metallic foil sheet with resin for an outer layer side, respectively, between a metallic foil sheet with resin for an outer layer and an inner layer member and applying laminate molding processing to a resulting laminate. CONSTITUTION:An epoxy resin impregnated glass fiber prepreg is arranged on each of both sides of a copper sticked double-sided laminated plate made of an inner layer material such as glass fiber-based epoxy resin. Outside the prepreg, copper foil sheets with epoxy resin layers are arranged via a glass fiber-based epoxy resin unclad laminated plate to obtain a laminate. The laminate is sandwiched between metal mold plates made of stainless steel and laminate molding processing is applied to the laminate to obtain a multilayer wiring substrate. The unclad plate is the integrally laminated prepregs alone used in the manufacture of the laminated plate for electric use. The prepreg may be of the same kind as or of a kind different from the prepreg used for the inner layer member or used on the upper and lower sides of the unclad plate. The metallic foil sheet with the resin for the outer layer is the metallic foil sheet made of a metal such as copper, zinc alone, its alloy or complex provided with a resin layer containing the resin used for the prepreg as a main component on one side. |
