| 摘要 |
<p>PURPOSE:To improve resistance to high humidity, resistance to high temperature, and heat dissipative property by laminating porous electronic circuit boards and intervening inorganic or metallic porous intermediate layer between adjacent electronic circuit boards, and filling resinin interstices. CONSTITUTION:For a multi-layer electronic circuit board, electronic circuit boards 1, 1 are laminated on the upper and lower portions of a central electronic circuit board 2, and these members are integrally bonded intervening porous intermediate layers 6 therebetween. For the electronic circuit 12 board 1, a film-like conductive circuit 12 and a film-like resistor 13 are formed on te surface side of a board porous ceramic sintered structure 11 in close contact with the same, and the film-like conductive circuit 12 is likewise formed on the back side of the same. The close contact state is such that the lower surfaces of the film-like conductive circuit 12 and the film-like resistor 13 bite into uneven surface portions among many ceramic particles 10 constituting the sintered structure 11. Further, in the sinered structure 11, resin 14 impregnated after the lamination is filled in interstices formed among the ceramic particles 10. Further, the electronic circuit board 2 is likewise constructed, and the porous intermediate layer 6 is impregnated with resin.</p> |
