| 摘要 |
PURPOSE:To fix an optical waveguide with a desired positional precision and to avoid chip cracks due to thermal expansion by providing a first solder area forming an immobile fixing part against the external force in the intra-face direction and a second solder area which forms a thermal stress absorbing part to enable a chip to relatively move at the time of thermal expansion and is made of a solder softer than that of the first solder area. CONSTITUTION:A first solder area A which mainly forms the immobile fixing part against the external force in an about intra-face direction and a second solder area C which forms the thermal stress absorbing part to enable chip 5 to relatively move at the time of thermal expansion and is made of a solder softer than that of the first solder area A are provided on a solder junction surface. A desired chip positional precision is obtained because the first solder area A functions as the immobile fixing part against the external force in an about intra-face direction, and the chip can be relatively moved because the second solder area C functions as the thermal stress absorbing part for thermal expansion. Thus, the optical waveguide is fixed to a substrate 6 while keeping the desired positional precision, and trouble like cracks due to thermal expansion is effectively avoided. |
